Which products are affected?
Application I/O, Standard I/O
What happens?
When the soldering step is executed during the production process solder beads may have settled underneath the socket terminal strip X10 of the FIF modules (see picture). Thus it is not possible to plug the 2*13 pole plug connector of the 8200vector on the socket terminal strip X10 of the FIF module in order to prevent the FIF module from contacting the basic device.
When does the problem occur?
The contacting problem occurs if it is tried to contact the FIF module with the basic device by means of a 2*13 pole plug connector during commissioning or when the FIF module is exchanged.
Possible diagnostics?
When the 13 pole plug connector is to be attached on the socket terminal strip X10 it can be seen if there are solder beads underneath the socket terminal strips. If the plug connector cannot be attached properly, the function restriction described before has occurred.
Short-term measures/recommendations?
Replacement of the FIF module
Evaluation:
This error is a manufacturing deficiency. The function restriction will already be detected during assembly, commissioning or when the FIF module is to be replaced.
This error profile already occurred sporadically at the end of 2005. In week 19/2006 it was detected that an increased number of Application I/O and Standard I/O modules produced showed the behaviour described before (approx. 5% of the modules produced according to LDS investigations). The identification numbers affected are listed in the table below:
Id.-No. Designation Version
13018572 Application I/O function module 3G35
13052164 Application I/O function module, PT variant 3G35
13018822 Application I/O function module, coated design 3G35
13063555 Standard I/O function module, PT variant 3F
